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Optical Components

Media Alert: The SNIA Announces Speaker Lineup for Its Inaugural Storage Plumbing and Data Engineering Conference

SAN FRANCISCO, CA--(Marketwired - May 23, 2013) - The Storage Networking Industry Association (SNIA) is pleased to announce an industry leading lineup of speakers at its Storage Plumbing and Data Engineering Conference (SPDEcon), June 10-12, 2013.

DETAILS:
SPDEcon is...(More)



Cadence Completes Acquisition of Cosmic Circuits

SAN JOSE, CA--(Marketwired - May 23, 2013) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that it has completed the acquisition of Cosmic Circuits Private Limited, a l...(More)



NexPlanar Announces Major Capacity Expansion for Semiconductor CMP Pads

HILLSBORO, OR--(Marketwired - May 23, 2013) - Rapidly increasing customer demand for NexPlanar's advanced semiconductor CMP pads has necessitated a significant capacity expansion in both the U.S. and Asia.

Since NexPlanar opened its Hillsboro, Oregon operation two years a...(More)



Unigen Announces Family of Rugged Solid State Drives

FREMONT, CA--(Marketwired - May 23, 2013) - Unigen Corporation has announced a family of Rugged SSDs designed for embedded industrial applications, networking switches and routers, automotive, medical and communication equipment. The Rugged SSDs are available in 1.8" and 2.5" form factors, ...(More)



MEDIA ALERT: Oski Technology to Showcase Its Industry-Proven Formal Sign-Off Methodology at DAC

MOUNTAIN VIEW, CA--(Marketwired - May 23, 2013) -

WHO:
Oski Technology (www.oskitech.com), the world's only dedicated formal verification services provider

WHAT:
...(More)



MEDIA ALERT: ProPlus Design Solutions to Offer Journey "From Nano-Scale Modeling to Giga-Scale Simulations"

SAN JOSE, CA--(Marketwired - May 23, 2013) -

WHO: ProPlus Design Solutions, Inc. (www.proplussolutions.com), the global leader for SPICE modeling solutions and the leading technology provider for Design-for-Yield (DFY...(More)



Global Communication Semiconductors, LLC (GCS) Announces Two InGaP HBT Foundry Processes to Address the VCO for Point-to-Point and 12V PA for Small Cell PA Infrastructure Markets

TORRANCE, CA--(Marketwired - May 23, 2013) - Global Communication Semiconductors, LLC. (GCS), a pure-play III-V compound semiconductor wafer foundry announced today that its proprietary InGaP HBT D5 and P7 foundry processes will now be offered to address the wide tuning range VCO and the 12V PA ...(More)



MEDIA ALERT: Forte Design Systems Heads to 50th Design Automation Conference With Cynthesizer 5, Next-Generation SystemC High-Level Synthesis

SAN JOSE, CA--(Marketwired - May 23, 2013) -

WHO: Forte Design Systems™ (www.ForteDS.com), the #1 provider of SystemC synthesis products, enabling design at a higher level of abstraction and improving design results...(More)



MEDIA ALERT: Cadence Celebrates 25 Years as a Leader in the EDA Industry at 50th DAC

SAN JOSE, CA--(Marketwired - May 23, 2013) - Cadence Design Systems, Inc. (NASDAQ: CDNS)

WHO:
Cadence Design Systems, Inc. (NASDAQ: ...(More)



PLX Technology VP to Address PCI Express in Enterprise Storage at Cowen and Company Technology, Media & Telecom Conference

SUNNYVALE, CA--(Marketwired - May 23, 2013) - PLX Technology, Inc. (NASDAQ: PLXT), the global leader in PCI Express® (PCIe®) silicon and software connectivity solutions enabling emerging data center archit...(More)



MEDIA ALERT: Cadence Issues Call for Papers for MemCon 2013

SAN JOSE, CA--(Marketwired - May 23, 2013) - Cadence Design Systems, Inc. (NASDAQ: CDNS)

WHO:
Cadence Design Systems, Inc. (NASDAQ: More)



Infinera Corporation Announces Proposed $100 Million Offering of Convertible Senior Notes Due 2018

SUNNYVALE, CA--(Marketwired - May 22, 2013) - Infinera Corporation (NASDAQ: INFN) today announced its intention to offer, subject to market conditions and other factors, $100 million aggregate principal amount of convertible senior ...(More)



STMicroelectronics Announces Jean-Marc Chery as General Manager of the Embedded Processing Solutions Segment and New Appointments to the Corporate Strategic Committee

GENEVA--(Marketwired - May 22, 2013) - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today that, effective immediately, ST Executive Vice Pres...(More)



Vishay Intertechnology Expands Its 650 V N-Channel Power MOSFET Series With 23 New Devices Offering On-Resistance Down to 30 Milliohms and Currents From 6 A to 105 A

MALVERN, PA--(Marketwired - May 22, 2013) - Vishay Intertechnology, Inc. (NYSE: VSH) today added additional 650 V power MOSFETs to its E Series family of devices. These 22 new devices in eight different packages offer an extended on-re...(More)



STMicroelectronics Reveals Latest Power Technology for Greener Industry and Infrastructure

GENEVA--(Marketwired - May 22, 2013) - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced its latest generation of energy-eff...(More)



TSMC Certifies Cadence Tempus Timing Signoff Solution for 20nm Designs

SAN JOSE, CA--(Marketwired - May 22, 2013) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that TSMC has certified the new Cadence® Tempus™ Timing Signoff So...(More)



Vitesse Delivers New Paradigm for Secure Cloud Applications

CAMARILLO, CA--(Marketwired - May 22, 2013) - Continuing its drive to strategically advance Carrier and Enterprise Ethernet technology, Vitesse Semiconductor Corporation (More)



MEDIA ALERT: Secrets of Design for Yield to Be Explored During 50th Design Automation Conference Pavilion Panel

LOUISVILLE, CO--(Marketwired - May 21, 2013) -

WHO: The 50th Design Automation Conference (DAC), the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions

...(More)



Vishay Intertechnology to Showcase Leading MLCCs and Surface-Mount and Wire-Bondable Thin Film Products at IMS 2013

MALVERN, PA--(Marketwired - May 21, 2013) - Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing the company's latest industry-leading multi-layer ceramic chip capacitors (MLCCs) and surface-mount and wir...(More)



900 North Michigan Shops Chooses Prysm Videowalls to Make Its Luxury Brands Shine

SAN JOSE, CA--(Marketwired - May 21, 2013) - Prysm Inc., a designer and manufacturer of videowall systems that deliver immersive and engaging user experiences, today announced the installation of its award-winning Laser Phosphor Display (LPD) videowalls at 900...(More)



PLX Teams With Avnet, Mindshare for PCI Express Technical Seminar

SUNNYVALE, CA--(Marketwired - May 21, 2013) - PLX Technology, Inc. (NASDAQ: PLXT), the global leader in PCI Express® (PCIe®) silicon and software connectivity enabling emerging data ce...(More)



MEDIA ALERT: Call for Papers for CDNLive Boston 2013 User Conference Now Open

SAN JOSE, CA--(Marketwired - May 21, 2013) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, has announced the More)



NXP Delivers Industry's First Ultra-Wideband Doherty Amplifiers

EINDHOVEN, THE NETHERLANDS--(Marketwired - May 21, 2013) - NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the availability of its ultra-wideband Doherty reference design using the More)



"Places2Be" Project to Boost European Leadership Around FD-SOI -- The Faster, Cooler, Simpler Chip Technology

BRUSSELS, BELGIUM--(Marketwired - May 21, 2013) - STMicroelectronics (NYSE: STM)